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Week of:     View:   Day Week Month   Resource: Sample delivery and Visits@Hallway(Max capacity:5) SEM_CL@Structural Charac (Max capacity: 4) AFM_Dimension@Structural Charac (Max capacity: 4) Network Analyzer 100KHz@Optoelectronics (Max capacity: 6) Raman bench@Optoelectronics (Max capacity: 6) Photocurrent bench VIS-NIR@Optoelectronics (Max capacity: 6) Lasers bench@Optoelectronics (Max capacity: 6) DLOS/DLTS@Optoelectronics (Max capacity: 6) Hall effect@Optoelectronics (Max capacity: 6) Probe Station@Optoelectronics (Max capacity: 6) XRD@X-Rays (Max capacity: 3) FFC-NMR@X-Rays (Max capacity: 3) PL-UV@Optical Charac (Max capacity: 6) PL-IR@Optical Charac (Max capacity: 6) FTIR@Optical Charac (Max capacity: 6) FTIR BRUKER SPOT@Optical Charac (Max capacity:6) MIR Photodetectors bench@Optical Charac (Max capacity: 6) UV Spectrophotometer@OPtic Charac (Max capacity: 6) Dicing saw@Dicing (Max capacity: 2) Polisher@Auxiliary Room (Max capacity: 3) Fume hood@Auxiliary room (Max capacity: 3) Electrochemistry@Auxiliary room (Max capacity: 3) Curve tracers@Electrical Charac (Max capacity: 5) Probe station (4 points)@Electrical Charac (Max capacity:5) Parameter Analyzer_HP 4145B@Electrical Charac (Max capacity: 5) Parameter Analyzer Rack-Agilent 4156@Electrical Charac (Max capacity: 5) VSM@Electrical Charac (Max capacity: 5) AGFM@Electrical Charac (Max capacity: 5) High temp probe station@Electrical Charac (Max capacity: 5) Hg Probe@Electrical Charac (Max capacity: 5) High/Low Temp Probe Station@Electrical Charac (Max capacity: 5) LCR_Capacimeter@Electrical Charac (Max capacity: 5) RF Station and Network Analyzer@Electrical Charac (Max capacity: 5) High Power/Temp Station and Curve Tracer@Electrical Charac (Max capacity: 5) MJB4 Aligner@Lithography (Max capacity: 4) MJB3 Aligner@Lithography (Max capacity: 4) Nanolithography (EBL)@Lithography (Max capacity: 4) Spinner@Lithography (Max capacity: 4) NanoFrazor(NF)@Lithography (Max. capacity:4) HORO 1 Oven@Lithography (Max capacity: 4) HORO 2 Oven@Nanolitografía (Aforo max Sala: 4) HORO 3 Oven@Lithography (Max capacity: 4) Varian Evaporator@Evaporators (Max capacity: 3) Balzers Evaporator@Evaporators (Max capacity: 3) Joule 1@Evaporators (Max capacity: 3) Joule 2@Evaporators (Max capacity: 3) Metal/Carbon Sputtering@Evaporators (Max capacity: 3) Glove_Box@Chemistry (Max capacity: 5) Fume hood 1@Chemistry (Max capacity: 5) Fume hood 2@Chemistry (Max capacity: 5) Fume hood 3@Chemistry (Max capacity: 5) Microbalance@Chemistry (Max capacity: 5) Wire bonder 1@Technology (Max capacity: 6) Wire bonder 2@Technology (Max capacity: 6) TPT HB100 Wire bonder@Technology (Max capacity: 6) Nomarski@Technology (Max capacity: 6) Contact profiler@Technology (Max capacity: 6) Profiler (Indra)@Technology (Max capacity: 6) Optical profiler@Technology (Max capacity: 6) Thickness interferometer@Technology (Max capacity: 6) Deterministic Transfer@Technology (Max capacity: 6) RIE-CVD@Processing (Max capacity: 6) RIE (Ar and O)@Processing (Max capacity: 6) ICP@Processing (Max capacity: 6) RTA@Processing (Max capacity: 6) Conventional Oven@Processing (Max capacity: 6) Oxigen plasma@Processing (Max capacity: 6) Graphene CVD@Processing (Max capacity: 6) Nitrides Sputtering@Processing (Max capacity: 6) Magnetic nanoparticles Sputtering@Sputtering (Max capacity: 5) Ar_Milling@Sputtering (Max capacity: 5) Sputtering_1@Sputtering (Max capacity: 5) Sputtering_2@Sputtering (Max capacity: 5) MECA2000@MBE 1 (Max capacity: 4) Arsenides MBE@MBE 1 (Max capacity: 4) Nitrides RIBER MBE@MBE 2 (Max capacity: 4) MBE_AsP@MBE 2 (Max capacity: 4) BEAMER AFM_NanoScope@Structural Charac (Max capacity: 4) DLTS/DLOS/Photocurrent I@Optoelectronics (Max capacity: 6) Photocurrent II@Optoelectronics (Max capacity: 6) Montana cryostat@Optoelectronics (Max capacity: 6) All    [* = click for details]    Now:03:50

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